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datashee t product structure silicon monolithic integrated circuit this product has no designed protec tion against radioactive rays 1/22 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 14? 001 tsz02201-0e3e0h300360-1-2 21.feb.2014 rev.002 2ch high side switch ics for usb devices and memory cards bd2062fj-lb bd2066fj-lb general description this is the product guarantees long time support in industrial market. high side switch for usb is a high side switch having over-current protection used in power supply line of universal serial bus (usb). its switch unit has two channels of n-channel power mosfet. and, over-current detection circuit, thermal shutdown circuit, under-voltage lockout and soft-start circuit are built in. features ? long time support a product for industrial applications. ? dual n-mos high side switch ? current limit threshold 2.4a ? control input logic ? active-low : bd2062fj ? active-high: bd2066fj ? soft-start circuit ? over-current detection ? thermal shutdown ? under-voltage lockout ? open-drain error flag output ? reverse current protection when power switch off ? flag output delay filter built in ? ttl enable input ? 0.8ms typical rise time applications industrial equipment, pc, pc peripheral usb hub in consumer appliances, key specifications ? input voltage range: 2.7v to 5.5v ? on resistance : 80m ? (typ.) ? over current threshold: 1.5a min., 3.0a max. ? standby current: 0.01 a (typ.) ? operating temperature range: -40 to +85 package w(typ.) d(typ.) h (max.) sop-j8 4.90mm x 6.00mm x 1.65mm car accessory, and so forth typical application circuit lineup over current detection control input logic package orderable part number min. typ. max. 1.5a 2.4a 3.0a low sop-j8 reel of 2500 bd2062fj ? lbe2 1.5a 2.4a 3.0a high sop-j8 reel of 2500 bd2066fj ? lbe2 sop-j8 gnd in / en1 (en1) /oc1 out1 out2 / oc2 5v(typ.) bd2062fj/66fj c l data /en2 (en2) c in data c l
2/22 bd2062fj-lb bd2066fj-lb datasheet www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 tsz02201-0e3e0h300360-1-2 21.feb.2014 rev.002 block diagram gate logic1 ocd1 char ge pump1 tsd1 uvlo char ge pump2 ocd2 gate logic2 tsd2 /en1 en1 in /en2 en2 gnd / oc1 o ut 1 o ut 2 / oc2 del ay del ay pin configurations pin descriptions bd2062fj pin no. symbol i / o pin function 1 gnd - ground. 2 in - power supply input. input terminal to the switch and po wer supply input terminal of the internal circuit. 3, 4 /en i enable input. switch on at low level. high level input > 2.0v, low level input < 0.8v. 5, 8 /oc o error flag output. low at over-current, thermal shutdown. open drain output. 6, 7 out o switch output. bd2066fj pin no. symbol i / o pin function 1 gnd - ground. 2 in - power supply input. input terminal to the switch and po wer supply input terminal of the internal circuit. 3, 4 en i enable input. switch on at high level. high level input > 2.0v, low level input < 0.8v 5, 8 /oc o error flag output. low at over-current, thermal shutdown. open drain output. 6, 7 out o switch output. bd2062fj top view 1 2 8 7 gnd in /oc1 out1 3 /en1 4 6 5 out2 /oc2 /en2 bd2066fj top view 1 2 8 7 gnd in /oc1 out1 3 /en1 4 6 5 out2 /oc2 /en2
3/22 bd2062fj-lb bd2066fj-lb datasheet www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 tsz02201-0e3e0h300360-1-2 21.feb.2014 rev.002 absolute maximum ratings (ta=25 ) parameter symbol ratings unit supply voltage v in -0.3 to 6.0 v enable input voltage v en -0.3 to 6.0 v /oc voltage v /oc -0.3 to 6.0 v /oc sink current is /oc 5 ma out voltage v out -0.3 to 6.0 v storage temperature t stg -55 to 150 power dissipation pd 675 *1 mw *1 mounted on 70mm * 70mm * 1.6mm glass-epoxy pcb. derating : 5.4mw/ o c above ta=25 o c recommended operating range parameter symbol ratings unit min. typ. max. operating voltage v in 2.7 - 5.5 v operating temperature t opr -40 - 85 electrical characteristics bd2062fj (unless otherwise specified v in = 5.0v, ta = 25 ) parameter symbol limits unit conditions min. typ. max. operating current i dd - 130 180 a v /en = 0v , out=open standby current i stb - 0.01 1 a v /en = 5v , out=open /en input voltage v /en 2.0 - - v high input v /en - - 0.8 v low input /en input current i /en -1.0 0.01 1.0 a v /en = 0v or v /en = 5v /oc output low voltage v /ocl - - 0.5 v i /oc = 1ma /oc output leak current il /oc - 0.01 1 a v /oc = 5v /oc delay time t /oc 10 15 20 ms on-resistance r on - 80 125 m? i out = 500ma switch leak current il sw - - 1.0 a v /en = 5v, v out = 0v reverse leak current il rev - - 1.0 a v out = 5.5v, v in = 0v current limit threshold i th 1.5 2.4 3.0 a short circuit current i sc 1.1 1.5 2.1 a v out = 0v c l = 47 f (rms) output rise time t on1 - 0.8 10 ms r l = 10 ? output turn-on time t on2 - 1.1 20 ms r l = 10 ? output fall time t off1 - 5 20 s r l = 10 ? output turn-off time t off2 - 10 40 s r l = 10 ? uvlo threshold v tuvh 2.1 2.3 2.5 v increasing v in v tuvl 2.0 2.2 2.4 v decreasing v in
4/22 bd2062fj-lb bd2066fj-lb datasheet www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 tsz02201-0e3e0h300360-1-2 21.feb.2014 rev.002 electrical characteristics - continued bd2066fj (unless otherwise specified v in = 5.0v, ta = 25 ) parameter symbol limits unit condition min. typ. max. operating current i dd - 130 180 a v en = 5v , out=open standby current i stb - 0.01 1 a v en = 0v , out=open en input voltage v en 2.0 - - v high input v en - - 0.8 v low input en input current i en -1.0 0.01 1.0 a v en = 0v or v en = 5v /oc output low voltage v /ocl - - 0.5 v i /oc = 1ma /oc output leak current il /oc - 0.01 1 a v /oc = 5v /oc delay time t /oc 10 15 20 ms on-resistance r on - 80 125 m ? i out = 500ma switch leak current il sw - - 1.0 a v en = 0v, v out = 0v reverse leak current il rev - - 1.0 a v out = 5.5v, v in = 0v current limit threshold i th 1.5 2.4 3.0 a short circuit current i sc 1.1 1.5 2.1 a v out = 0v c l = 47 f (rms) output rise time t on1 - 0.8 10 ms r l = 10 ? output turn-on time t on2 - 1.1 20 ms r l = 10 ? output fall time t off1 - 5 20 s r l = 10 ? output turn-off time t off2 - 10 40 s r l = 10 ? uvlo threshold v tuvh 2.1 2.3 2.5 v increasing v in v tuvl 2.0 2.2 2.4 v decreasing v in
5/22 bd2062fj-lb bd2066fj-lb datasheet www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 tsz02201-0e3e0h300360-1-2 21.feb.2014 rev.002 measurement circuit gnd in en1 en2 /oc1 out1 out2 /oc2 v in v en a 1f v en gnd in en1 en2 /oc1 out1 out2 /oc2 v in v en 1f v en r l c l r l c l a. operating current b. en, /en i nput voltage, output rise, fall time inrush current gnd in en1 en2 /oc1 out1 out2 /oc2 v in v en 1f v en i out i out v dd gnd in en1 en2 /oc1 out1 out2 /oc2 v in v en 1f v en i out 10k 10k i out c. on-resistance, over-current de tection d. /oc output low voltage figure 1. measurement circuit timing diagram t on2 50% t on1 10% 90% 50% 90% 10% t off1 v out v/ en t off2 t on2 50% t on1 10% 90% 50% 90% 10% t off1 v out v en t off2 figure 2. timing diagram(bd2062fj) figure 3. timing diagram(bd2066fj)
6/22 bd2062fj-lb bd2066fj-lb datasheet www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 tsz02201-0e3e0h300360-1-2 21.feb.2014 rev.002 typical performance curves (reference data) figure 4. operating current en, /en enable 0 20 40 60 80 100 120 140 160 180 23 456 supply voltage: v in (v) operating current: i dd (ua) t a =25 figure 6. standby current en, /en disable 0 0.2 0.4 0.6 0.8 1 23456 supply voltage: v in (v) standby current: i dd (ua) t a =25 figure 5. operating current en, /en enable 0 20 40 60 80 100 120 140 160 180 -50 0 50 100 ambient temperature: t a ( ) operating current: i dd (ua) v in =5v figure 7. standby current en, /en disable 0 0.2 0.4 0.6 0.8 1 -50 0 50 100 ambient temperature: t a ( ) standby current: i dd (ua) v in =5v
7/22 bd2062fj-lb bd2066fj-lb datasheet www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 tsz02201-0e3e0h300360-1-2 21.feb.2014 rev.002 typical performance curves - continued figure 8. en, /en input voltage 0 0.5 1 1.5 2 23456 supply voltage: v in (v) en input voltage: v en (v) t a =25 low to high high to low figure 9. en, /en input voltage 0 0.5 1 1.5 2 -50 0 50 100 ambient temperature: t a ( ) en input voltage: v en (v) v in =5v high to low low to high figure 11. /oc output low voltage 0 20 40 60 80 100 -50 0 50 100 ambient temperature: t a ( ) /oc output voltage: v /oc (mv) v in =5v figure 10. /oc output low voltage 0 20 40 60 80 100 23 456 supply voltage: v in (v) /oc output voltage: v /oc (mv) t a =25
8/22 bd2062fj-lb bd2066fj-lb datasheet www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 tsz02201-0e3e0h300360-1-2 21.feb.2014 rev.002 typical performance curves - continued figure 12. on-resistance 0 20 40 60 80 100 120 23 456 supply voltage: v in (v) on resistance: r on (m ? ) t a =25 figure 13. on-resistance 0 20 40 60 80 100 120 -50 0 50 100 ambient temperature: t a ( ) on resistance: r on (m ? ) v in =5v figure 14. current limit threshold 1.5 2 2.5 3 23456 supply voltage: v in (v) current limt threshold: i th (a) t a =25 1.5 2 2.5 3 -50 0 50 100 ambient temperature: t a ( ) current limit threshold: i th (a) v in =5v figure 15. current limit threshold
9/22 bd2062fj-lb bd2066fj-lb datasheet www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 tsz02201-0e3e0h300360-1-2 21.feb.2014 rev.002 typical performance curves - continued figure 19. output rise time 0 0.2 0.4 0.6 0.8 1 -50 0 50 100 ambient temperature: t a ( ) rise time: t on1 (ms) v in =5v figure 18. output rise time 0 0.2 0.4 0.6 0.8 1 23456 supply voltage: v in (v) rise time: t on1 (ms) t a =25 figure 17. short circuit current 0 0.5 1 1.5 2 -50 0 50 100 ambient temperature: t a ( ) short circuit current:i sc (a) v in =5v figure 16. short circuit current 0 0.5 1 1.5 2 23456 supply voltage: v in (v) short circuit currnt: i sc (a) t a =25
10/22 bd2062fj-lb bd2066fj-lb datasheet www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 tsz02201-0e3e0h300360-1-2 21.feb.2014 rev.002 figure 23. output fall time 0 1 2 3 4 5 -50 0 50 100 ambient temperature: t a ( ) fall time: t off1 (us) v in =5v typical performance curves - continued figure 20. output turn-on time 0 0.2 0.4 0.6 0.8 1 23456 supply voltage: v in (v) turn on time: t on2 (ms) t a =25 figure 21. output turn-on time 0 0.2 0.4 0.6 0.8 1 -50 0 50 100 ambient temperature: t a ( ) turn on time: t on2 (ms) v in =5v figure 22. output fall time 0 1 2 3 4 5 23 456 supply voltage: v in (v) fall time: t off1 (us) t a =25
11/22 bd2062fj-lb bd2066fj-lb datasheet www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 tsz02201-0e3e0h300360-1-2 21.feb.2014 rev.002 typical performance curves - continued figure 24. output turn-off time 0 2 4 6 8 10 23 456 supply voltage: v in (v) turn off time: t off2 (us) t a =25 figure 25. output turn-off time 0 2 4 6 8 10 -50 0 50 100 ambient temperature: t a () turn off time: t off2 (us) v in =5v figure 26. /oc delay time 0 5 10 15 20 23 456 supply voltage: v in (v) /oc delay time: t /oc (ms) t a =25 figure 27. /oc delay time 0 5 10 15 20 -50 0 50 100 ambient temperature: t a ( ) /oc delay time: t /oc (ms) v in =5v
12/22 bd2062fj-lb bd2066fj-lb datasheet www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 tsz02201-0e3e0h300360-1-2 21.feb.2014 rev.002 typical performance curves - continued figure 28. uvlo threshold voltage 0 0.05 0.1 0.15 0.2 -50 0 50 100 ambient temperature: t a ( ) uvlo hysteresis: v hy s (v) figure 29. uvlo hysteresis voltage 2 2.1 2.2 2.3 2.4 2.5 -50 0 50 100 ambient temperature: t a ( ) uvlo threshold: v uvlo (v) v uvloh v uvlol
13/22 bd2062fj-lb bd2066fj-lb datasheet www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 tsz02201-0e3e0h300360-1-2 21.feb.2014 rev.002 typical wave forms bd2062fj figure 32. inrush current cl=47uf, 100uf, 147uf, 220uf /en 1v/div vout 1v/div v/oc 1v/div iin 0.5a/div time 200us/div vin=5v rl=5 cl=47uf cl=220uf cl=47uf cl=220uf figure 33. inrush current vout1 1v/div vout2 1v/div v/oc1 1v/div iout1 1.0a/div time 200us/div vin=5v cl=220uf c=10uf rl=5 figure 30. output rise characteristics vin=5v cl=100uf rl=5 /en 1v/div vout 1v/div v/oc 1v/div iin 0.5a/div time 200us/div figure 31. output fall characteristics /en 1v/div vout 1v/div v/oc 1v/div iin 0.5a/div time 1ms/div vin=5v cl=100uf rl=5
14/22 bd2062fj-lb bd2066fj-lb datasheet www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 tsz02201-0e3e0h300360-1-2 21.feb.2014 rev.002 typical wave forms - continued figure 35. over-current response 1 load connected at enable vout1 1v/div v/oc1 1v/div vout2 1v/div iout1 1.0a/div time 2ms/div vin=5v cl=47uf figure 37. thermal shutdown res p onse v/oc2 1v/div vout1 1v/div v/oc1 1v/div iout1 0.5a/div time 100ms/div vin=5v cl=47uf figure 34. over-current response ramped load vout2 1v/div vout1 1v/div v/oc1 1v/div iout1 0.5a/div time 5ms/div vin=5v cl=47uf figure 36. over-current response enable to short circuit /en 1v/div vout 1v/div voc 1v/div iout1 0.5a/div time 2ms/div vin=5v cl=47uf rl=1
15/22 bd2062fj-lb bd2066fj-lb datasheet www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 tsz02201-0e3e0h300360-1-2 21.feb.2014 rev.002 typical application circuit on/off oc oc on/off gnd in /en1 (en1) / oc1 out1 out2 / oc2 10k to 100k 5v(typ.) out in vbus d+ d- gnd data regulator usb controller bd2062fj/66fj c l data /en2 (en2) 10k to 100k c in data c l application information when excessive current flows due to output short-circuit or so , ringing occurs because of inductance between power source lines to ic, and may cause bad influences on ic operations. in order to avoid this case, connect a bypass capacitor across in terminal and gnd terminal of ic. 1 f or higher is recommended. pull up /oc output by resistance 10k ? to 100k ?. set up value which satisfies the application as c l . this application circuit does not guarantee its operation. when using the circuit with changes to the external circuit c onstants, make sure to leave an adequate margin for external components including ac/dc characteristi cs as well as dispersion of the ic. functional description 1. switch operation in terminal and out terminal are connected to the drain and the source of switch mosfet respectively. and the in terminal is used also as power source input to internal control circuit. when the switch is turned on from en/en control in put, in terminal and out terminal are connected by a 80m ? switch. in on status, the switch is bidirectional. therefore, when the potent ial of out terminal is higher than that of in terminal, current flows from out te rminal to in terminal. since a parasitic diode between the drain and the source of swit ch mosfet is not present in the off status, it is possible to prevent current from flowin g reversely from out to in. 2. thermal shutdown circuit (tsd) thermal shut down circuit have dual thermal shutdown thre shold. since thermal shutdown works at a lower junction temperature when an over-current occurs, only the switch of an over-current state becom e off and error flag is output. thermal shut down action has hysteresis . therefore, when the junction temperat ure goes down, switch on and error flag output automatically recover. however, until cause of junc tion temperature increase such as output shortcircuit is removed or the switch is turned off, t hermal shut down detection and recovery are repeated. the thermal shut down circuit works when the switch of either out1 or out2 is on (en,/en signal is active).
16/22 bd2062fj-lb bd2066fj-lb datasheet www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 tsz02201-0e3e0h300360-1-2 21.feb.2014 rev.002 3. over-current detection (ocd) the over-current detection circuit limits current (isc) and out puts error flag (/oc) when current flowing in each switch mosfet exceeds a specified va lue. there are three types of response against over-current. the over-current detection circuit works when the switch is on (en,/en signal is active). 3-1. when the switch is turned on while the output is in short-circuit state when the switch is turned on while the output is in short-circ uit status, the switch goes into current limit status immediately. 3-2. when the output short-circui ts while the switch is on when the output short-circuits or high-cu rrent load is connected while the switch is on, very large current flows until the over-current limit circuit takes into action. when the curr ent is detected, limiter circui t works, current limitation is carried out. 3-3. when the output curre nt increases gradually when the output current increases gradually, current limitation does not work until the output current exceeds the over-current detection value. when it exceeds the detection value, current limitation is carried out. 4. under-voltage lockout (uvlo) uvlo circuit prevents the switch from turning on until the vin exceeds 2.3v(typ .). if the vin drops below 2.2v(typ.) while the switch turns on, then uvlo shuts off the switch. uvlo has hysteresis of 100mv(typ). under-voltage lockout circuit works when the switch of either out1 or out2 is on (en,/en signal is active). 5. error flag (/oc) output error flag output is n-mos open drain output. at detection of ov er current or thermal shutdown, the output level is low. over-current detection has delay filter. this delay filter prevents instantaneous curr ent detection such as inrush current at switch on, hot plug from being informed to outside. v /en v out i out v /oc out p ut shortcircuit thermal shut down delay figure 38. over current detection, thermal shutdown timing (bd2062fj) v en v out i out v /oc out p ut shortcircuit thermal shut down delay figure 39. over current detection, thermal shutdown timing (bd2066fj)
17/22 bd2062fj-lb bd2066fj-lb datasheet www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 tsz02201-0e3e0h300360-1-2 21.feb.2014 rev.002 power dissipation (sop-j8) figure 40. power dissipation curve (pd-ta curve) i/o equivalence circuit symbol pin no equivalence circuit en1(/en1) en2(/en2) 3, 4 /en1(en1) /en2(en2) /oc1 /oc2 5, 8 / oc1 / oc2 out1 out2 6, 7 out1 out2 0 100 200 300 400 500 600 0 25 50 75 100 125 150 ambient temperature: ta [ ] power dissipation: pd[mw]
18/22 bd2062fj-lb bd2066fj-lb datasheet www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 tsz02201-0e3e0h300360-1-2 21.feb.2014 rev.002 operational notes (1) absolute maximum ratings operating the ic over the absolute maximum ratings may damage the ic. the damage can either be a short circuit between pins or an open circuit between pins. therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the ic is operated over the absolute maximum ratings. (2) recommended operating conditions these conditions represent a range within which the expected characteristics of the ic can be approximately obtained. the electrical characteristics are guaranteed under the conditions of each parameter. (3) reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the ic?s power supply terminals. (4) power supply lines design the pcb layout pattern to provide low impedance ground and supply lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. furthermore, connect a capacitor to ground at a ll power supply pins. consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. (5) ground voltage the voltage of the ground pin must be the lowest voltage of all pins of the ic at all operating conditions. ensure that no pins are at a voltage below the ground pin at any time, even during transient condition. (6) short between pins and mounting errors be careful when mounting the ic on printed circuit boards. the ic may be damaged if it is mounted in a wrong orientation or if pins are shorted together. short circuit may be caused by conductive particles caught between the pins. (7) operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field may cause the ic to malfunction. (8) testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low-impedance output pin may subject the ic to stress. always discharge capacitors completely after each process or step. the ic?s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic during assembly and use similar precautions during transport and storage. (9) regarding input pins of the ic this monolithic ic contains p+ isolation and p substrate laye rs between adjacent elements in order to keep them isolated. p-n junctions are formed at the intersection of the p layers wi th the n layers of other elements, creating a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p-n junction operates as a parasitic diode when gnd > pin b, the p-n junction operates as a parasitic transistor. parasitic diodes inevitably occur in the structure of the ic. the operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the gnd voltage to an input pin (and thus to the p substrate) should be avoided. resistor transistor (npn) n n n p + p + p p substrate gnd parasitic element pin a n n p + p + p p substrate gnd parasitic element pin b c b e n gnd pin a pin b other adjacent elements e b c gnd parasitic element parasitic element figure 41. example of monolithic ic structure
19/22 bd2062fj-lb bd2066fj-lb datasheet www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 tsz02201-0e3e0h300360-1-2 21.feb.2014 rev.002 (10) gnd wiring pattern when using both small-signal and large-current gnd traces , the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. also ensure that the gnd traces of external components do not cause variations on the gnd voltage. the power supply and ground lines must be as short and thick as possible to reduce line impedance. (11) external capacitor when using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to dc bias and others. (12) thermal shutdown circuit (tsd) the ic incorporates a built-in thermal shutdown circuit, which is designed to turn off the ic when the internal temperature of the ic reaches a specified value. do not continue to operate the ic after this function is activated. do not use the ic in conditions where this function will always be activated. (13) thermal consideration use a thermal design that allows for a sufficient margin by taking into account the permissible power dissipation (pd) in actual operating conditions. consider pc that does not exceed pd in actual operating conditions (pc pd). package power dissipation : pd (w)=(tjmax ta ) / ja power dissipation : pc (w)=(vcc vo)io+vccib tjmax : maximum junction temperature=150 , ta : peripheral temperature[ ] , ja : thermal resistance of package-ambience[ /w], pd : package power dissipation [w], pc : power dissipation [w], vcc : input voltage, vo : output voltage, io : load, ib : bias current
20/22 bd2062fj-lb bd2066fj-lb datasheet www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 tsz02201-0e3e0h300360-1-2 21.feb.2014 rev.002 ordering information b d 2 0 6 x f j - l b e 2 part numbe r package fj: sop-j8 product class lb for industrial applications packaging and forming specification e2: embossed tape and reel marking diagram part number part number marking bd2062fj d2062 bd2066fj d2066 sop-j8 (top view) part number marking lot number 1pin mark
21/22 bd2062fj-lb bd2066fj-lb datasheet www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 tsz02201-0e3e0h300360-1-2 21.feb.2014 rev.002 physical dimension tape and reel information package name sop-j8 ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs e2 () direction of feed reel 1pin
22/22 bd2062fj-lb bd2066fj-lb datasheet www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 tsz02201-0e3e0h300360-1-2 21.feb.2014 rev.002 revision history date revision changes 13.mar.2013 001 new release 21.feb.2014 002 delete sentence ?and log life cycle? in general description and futures (page 1). change ?industrial applications? to ?industrial equipment? in applications (page 1). applied new style (?title?, ?ordering information? and ?physical dimension tape and reel information?).
datasheet d a t a s h e e t notice - ss rev.002 ? 2014 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. if you intend to use our products in devices requiring extremely high reliability (such as medical equipment (note 1) , aircraft/spacecraft, nuclear power controllers, etc.) and whos e malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sales representative in advance. unless otherwise agreed in writ ing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses in curred by you or third parties arising from the use of any rohm?s products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are not designed under any special or extr aordinary environments or conditi ons, as exemplified below. accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohm?s products under an y special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range descr ibed in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification
datasheet d a t a s h e e t notice - ss rev.002 ? 2014 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin c onsidering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a hum idity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contain ed in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.
datasheet datasheet notice ? we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information.

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